Electric lamp and discharge devices – With luminescent solid or liquid material – Vacuum-type tube
Patent
1993-12-08
1995-04-11
Yusko, Donald J.
Electric lamp and discharge devices
With luminescent solid or liquid material
Vacuum-type tube
313497, 313422, 3151694, 445 24, H01J 154
Patent
active
054061709
ABSTRACT:
The present invention relates to light emitting devices which emit light upon impingement of thermoelectrons on a front panel having fluorescent elements and where an array of cathodes and electrodes are provided on a substrate within each light emitting device. Thus, in the present invention, first electrode leads having a coefficient of thermal expansion substantially equal to that of the substrate are inserted into and through the substrate, and second electrode leads having a coefficient of thermal expansion substantially equal to that of the rear panel are inserted into and through the rear panel, and the first and second electrode leads are connected such that the substrate is supported at a distance above the rear panel.
REFERENCES:
patent: 2731578 (1956-01-01), McCullough
patent: 3299305 (1967-01-01), Kreuder
patent: 3599027 (1971-08-01), Koshizuka et al.
patent: 4893056 (1990-01-01), Hara et al.
patent: 4900981 (1990-02-01), Yamazaki et al.
patent: 4954885 (1990-09-01), Ito et al.
patent: 4970430 (1990-11-01), Kamogawa et al.
patent: 4972116 (1990-11-01), Tatsuda et al.
patent: 5341065 (1994-08-01), Uemura et al.
Futatsuishi Shun-ichi
Hara Zenichiro
Iwata Shuji
Kamogawa Hiroshi
Kanda Isamu
Esserman Matthew J.
Ise Electronics Corporation
Mitsubishi Denki & Kabushiki Kaisha
Yusko Donald J.
LandOfFree
Light emitting device resistant to damage by thermal expansion does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light emitting device resistant to damage by thermal expansion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting device resistant to damage by thermal expansion will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1540960