Light emitting device package and method of manufacturing...

Details Light emitting device package and method of manufacturing... Light emitting device package and method of manufacturing...

2007-02-16

2010-06-15

Le, Uyen-Chau N (Department: 2874)

Optical waveguides

Miscellaneous

C257S081000, C257S093000

Reexamination Certificate

active

07738764

ABSTRACT:
A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from the package structure by an insulation film. The first and second electrodes are electrically connected with the two diffusion layers, respectively.

REFERENCES:
patent: 2002/0027229 (2002-03-01), Yamazaki et al.
patent: 2005/0051789 (2005-03-01), Negley et al.
patent: 2005/0230692 (2005-10-01), Kim et al.
patent: 2006/0132401 (2006-06-01), Yamazaki et al.
patent: 1684281 (2005-10-01), None
patent: 1 587 151 (2005-10-01), None
patent: 2004-259846 (2004-09-01), None

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