Light emitting device package

Details Light emitting device package Light emitting device package

2011-05-17

2011-05-17

Hoang, Quoc D (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Encapsulated

C438S022000

Reexamination Certificate

active

07943951

ABSTRACT:
A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on the base substrate and having an inner space for sealing the light emitting device and reflective surfaces formed along outer sides facing the inner space to guide light from the light emitting device in an effective display direction; and a sealing resin between the inner space to bond the base substrate to the molded lens, whereby the packaging structure is simplified so that an assembly process and reliability testing are simplified, process losses due to defects are minimized, and the light extraction efficiency from the light emitting device and heat-dissipation performance are improved.

REFERENCES:
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patent: 2002/0021085 (2002-02-01), Ng
patent: 2003/0025117 (2003-02-01), Isokawa et al.
patent: 2004/0183081 (2004-09-01), Shishov et al.
patent: 2004/0223315 (2004-11-01), Suehiro et al.
patent: 2005/0072981 (2005-04-01), Suenaga
patent: 2006/0138443 (2006-06-01), Fan et al.
patent: 2003-282955 (2003-03-01), None
Office Action issued by Korean Intellectual Property Office on Mar. 25, 2008.

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