Light emitting device mounting substrate, light emitting...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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C257SE33075

Reexamination Certificate

active

07868345

ABSTRACT:
A light-emitting apparatus with improved dissipation efficiency of heat transmitted to a specific electrode of a light-emitting device is provided. A light-emitting device mounting substrate used for the light emitting apparatus include a base body (1) which mounts thereon a light-emitting device (3); a first electrically conductive path (L1) formed within the base body (1), one end thereof being electrically connected to a first electrode (3a) of the light-emitting device (3) and the other end thereof being led out to a surface of the base body (1); and a second electrically conductive path (L2) formed in the base body (1), one end thereof being electrically connected to a second electrode (3b) of the light-emitting device (3), and the other end thereof being formed on the surface of the base body (1). The first electrically conductive path (L1) is made smaller in thermal resistance than the second electrically conductive path (L2).

REFERENCES:
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INFINEON, “Thermal Resistance. Theory and Practice”, 2000, pp. 1-33.
European search report for corresponding European application 05805336.4 lists the references above, Dec. 14, 2009.
Japanese language office action dated Sep. 14, 2010 and its English language translation for corresponding Japanese application 2006-543257.

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