Light emitting device and the manufacture method thereof

Details Light emitting device and the manufacture method thereof Light emitting device and the manufacture method thereof

2007-09-05

2011-11-29

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S094000, C257S079000, C257S103000, C257S195000, C257S096000, C257S097000, C257S098000, C257SE33065

Reexamination Certificate

active

08067780

ABSTRACT:
This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.

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