Light emitting device and method of fabricating light...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S751000, C257S772000, C257SE33063, C257SE23028

Reexamination Certificate

active

07829910

ABSTRACT:
Each second electrode formed on a second main surface of a compound semiconductor layer of a light emitting device has an alloyed contact layer disposed contacting the second main surface, aimed at reducing contact resistance with the compound semiconductor layer, and a solder layer connecting the alloyed contact layer to the conductive support. The solder layer forms therein a Sn-base solder layer disposed on the alloyed contact layer side having a melting point lower than the alloyed contact layer, and a Au—Sn-base solder layer disposed contacting the Sn-base solder layer opposed to the alloyed contact layer side, containing total Au and Sn of 80% or more, and having a melting point higher than the Sn-base solder layer. This configuration can provide excellent reliability of bonding between the Au—Sn-base solder layer and the alloyed contact layer, and consequently less causative of delamination of the Au—Sn-base solder layer.

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Takao, Hisaaki, et al., “Development of Highly Reliable Sn-Ag Lead-Free Solder Alloy,”The R&D Review, Jun. 2000, pp. 39-46, vol. 35, No. 2, Toyota Central Research Labs, Inc.

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