Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2007-09-06
2009-02-17
Lebentritt, Michael S (Department: 2829)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S149000, C438S151000, C438S166000, C257SE21413, C257SE27111, C257SE29290, C257SE29293
Reexamination Certificate
active
07491562
ABSTRACT:
In a light emitting device, it is preferable that a surface of a film below a light-emitting element has flatness. Therefore, treatment such as planarization of a surface of a film is performed after forming the film. The present invention proposes a structure of a light-emitting device that can make the foregoing planarization easier. The same layer as a wiring formed on a first film is used to manufacture a second film. Herewith, a portion of the first film below a light-emitting element can be prevented from being etched to form unevenness at a surface of the first film during the formation of the wiring. In addition, a surface of a third film is made higher by providing the second film to enable local planarization.
REFERENCES:
patent: 4769686 (1988-09-01), Horiuchi et al.
patent: 5652667 (1997-07-01), Kurogane
patent: 5757054 (1998-05-01), Miyawaki et al.
patent: 5767827 (1998-06-01), Kobayashi et al.
patent: 5933204 (1999-08-01), Fukumoto
patent: 6049132 (2000-04-01), Iwahashi et al.
patent: 6252249 (2001-06-01), Yamazaki
patent: 6384427 (2002-05-01), Yamazaki et al.
patent: 6400426 (2002-06-01), Yamazaki et al.
patent: 6556264 (2003-04-01), Hirakata et al.
patent: 6559594 (2003-05-01), Fukunaga et al.
patent: 6593990 (2003-07-01), Yamazaki
patent: 6608449 (2003-08-01), Fukunaga
patent: 6670637 (2003-12-01), Yamazaki et al.
patent: 6828725 (2004-12-01), Kimuri
patent: 7061186 (2006-06-01), Inukai et al.
patent: 7183582 (2007-02-01), Imamura
patent: 7301279 (2007-11-01), Sakakura et al.
patent: 7365494 (2008-04-01), Sato
patent: 7402948 (2008-07-01), Yamazaki et al.
patent: 7427834 (2008-09-01), Yamazaki
patent: 2001/0053559 (2001-12-01), Nagao et al.
patent: 2002/0011799 (2002-01-01), Kimura
patent: 2002/0021266 (2002-02-01), Koyama et al.
patent: 2002/0038998 (2002-04-01), Fujita et al.
patent: 2002/0047120 (2002-04-01), Inukai
patent: 2002/0047555 (2002-04-01), Inukai
patent: 2002/0080303 (2002-06-01), Izumi
patent: 2002/0121860 (2002-09-01), Seo et al.
patent: 2002/0134979 (2002-09-01), Yamazaki et al.
patent: 2003/0034497 (2003-02-01), Yamazaki et al.
patent: 2003/0052597 (2003-03-01), Sakurai
patent: 2003/0057422 (2003-03-01), Yamazaki et al.
patent: 2003/0058210 (2003-03-01), Yamazaki et al.
patent: 2003/0062826 (2003-04-01), Seo et al.
patent: 2003/0222334 (2003-12-01), Ikeda et al.
patent: 2004/0256979 (2004-12-01), Murakami et al.
patent: 1 096 303 (2001-05-01), None
patent: 2000-077191 (2000-03-01), None
patent: 2001-043980 (2001-02-01), None
patent: 2001-077191 (2001-03-01), None
patent: 2001-195015 (2001-07-01), None
patent: 2001-284342 (2001-10-01), None
patent: 2002-108250 (2002-04-01), None
patent: 2002-351355 (2002-12-01), None
patent: 2002-353466 (2002-12-01), None
patent: 2003-086356 (2003-03-01), None
patent: 2003-345267 (2003-12-01), None
International Search Report Dated Feb. 3, 2004 for PCT/JP03/15173.
International Preliminary Examination Dated Mar. 23, 2004, of PCT/JP03/15173.
Miyagi Noriko
Murakami Satoshi
Costellia Jeffrey L.
Lebentritt Michael S
Nixon & Peabody LLP
Semiconductor Energy Laboratory Co,. Ltd.
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