Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2005-06-14
2005-06-14
Pham, Hoai (Department: 2814)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S149000, C438S154000, C438S155000, C438S424000, C438S482000, C438S488000
Reexamination Certificate
active
06905907
ABSTRACT:
An element structure is provided in which film formation irregularities and deterioration of an organic compound layer formed on an electrode are prevented in an active matrix light emitting device. After forming an insulating film so as to cover edge portions of a conductor which becomes a light emitting element electrode, polishing is performed using a CMP (chemical mechanical polishing) method in the present invention, thus forming a structure in which surfaces of a first electrode and a leveled insulating layer are coplanar. The film formation irregularities in the organic compound layer formed on the electrode can thus be prevented, and electric field concentration from the edge portions of the electrode can be prevented.
REFERENCES:
patent: 5117299 (1992-05-01), Kondo et al.
patent: 5132676 (1992-07-01), Kimura et al.
patent: 5240801 (1993-08-01), Hayashi et al.
patent: 5330616 (1994-07-01), Yamazaki
patent: 5550066 (1996-08-01), Tang et al.
patent: 5583369 (1996-12-01), Yamazaki et al.
patent: 5592318 (1997-01-01), Majima et al.
patent: 5652667 (1997-07-01), Kurogane
patent: 5670792 (1997-09-01), Utsugi et al.
patent: 5706067 (1998-01-01), Colgan et al.
patent: 5714968 (1998-02-01), Ikeda
patent: 5739890 (1998-04-01), Uda et al.
patent: 5754263 (1998-05-01), Akiyama et al.
patent: 5757054 (1998-05-01), Miyawaki et al.
patent: 5767827 (1998-06-01), Kobayashi et al.
patent: 5817431 (1998-10-01), Shi et al.
patent: 5910271 (1999-06-01), Ohe et al.
patent: 5933204 (1999-08-01), Fukumoto
patent: 5940053 (1999-08-01), Ikeda
patent: 5946561 (1999-08-01), Yamazaki et al.
patent: 5949107 (1999-09-01), Zhang
patent: 6008876 (1999-12-01), Moore
patent: 6011529 (2000-01-01), Ikeda
patent: 6037197 (2000-03-01), Yamazaki et al.
patent: 6049132 (2000-04-01), Iwahashi et al.
patent: 6163055 (2000-12-01), Hirakata et al.
patent: 6294815 (2001-09-01), Yamazaki et al.
patent: 6326249 (2001-12-01), Yamazaki et al.
patent: 6396105 (2002-05-01), Yamazaki et al.
patent: 6468844 (2002-10-01), Yamazaki et al.
patent: 6538390 (2003-03-01), Fujita et al.
patent: 6-325869 (1994-11-01), None
patent: 7-111341 (1995-04-01), None
patent: 7-153576 (1995-06-01), None
patent: 8-054836 (1996-02-01), None
patent: 8-241047 (1996-09-01), None
patent: 10-189252 (1998-07-01), None
English Abstract re Japanese Patent Application No. JP 6-325869 published Nov. 25, 1994.
English Abstract re Japanese Patent Application No. JP 7-111341 published Apr. 25, 1995.
English Abstract re Japanese Patent Application No. JP 7-153576 published Jun. 16, 1995.
English Abstract re Japanese Patent Application No. JP 8-054836 published Feb. 27, 1996.
English Abstract re Japanese Patent Application No. JP 8-241047 published Sep. 17, 1996.
English Abstract re Japanese Patent Application No. JP 10-189252 published Jul. 21, 1998.
Cook Alex McFarron Manzo Cummings & Mehler, Ltd.
Louie Wai-Sing
Pham Hoai
Semiconductor Energy Laboratory Co,. Ltd.
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