Light emitting device and light emitting device package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257SE33063

Reexamination Certificate

active

07928464

ABSTRACT:
A light emitting device is provided. The light emitting device comprises: a conductive support substrate; a bonding layer on the conductive support substrate; a reflective layer on the bonding layer; and a light emitting structure layer on the reflective layer. The bonding layer comprises a solder bonding layer on the conductive support substrate and at least one of a diffusion barrier layer and an adhesion layer on the solder bonding layer, the solder bonding layer, the diffusion barrier layer, and the adhesion layer being formed of a metal or an alloy of which the Young's Modulus is 9 GPa to 200 GPa.

REFERENCES:
patent: 2004/0080049 (2004-04-01), Kim
patent: 2005/0142677 (2005-06-01), Kon et al.
patent: 2006/0043387 (2006-03-01), Hata
patent: 2006/0225644 (2006-10-01), Lee et al.
patent: 2008/0035949 (2008-02-01), Fudeta et al.
patent: 2008/0169481 (2008-07-01), Kobayashi et al.
patent: 2008/0210971 (2008-09-01), Donofrio et al.
patent: 2008/0265267 (2008-10-01), Unno
patent: 10-2005-0098213 (2005-10-01), None
patent: 10-2007-0013291 (2007-01-01), None
patent: 10-2008-0018299 (2008-02-01), None
patent: 10-2008-0102538 (2008-11-01), None

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