Light emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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Details

C257S079000, C257S100000, C257SE23023

Reexamination Certificate

active

10515141

ABSTRACT:
A CAN package light emitting device comprises a semiconductor laser1bonded on a sub mount6and a CAN package2for housing the semiconductor laser1bonded on the sub mount6. The CAN package2comprises a fixing structure3for fixing the semiconductor laser at a predetermined position, and a cap4covering the semiconductor laser1fixed to the fixing structure3. Vapor pressure of Si organic compound gas in the CAN package2is limited to or below 5.4×102N/m2to prevent any deposit as thick as inviting characteristics deterioration from being formed on the light emitting portion of the semiconductor laser1within the guaranteed time of its proper operation.

REFERENCES:
patent: 6396023 (2002-05-01), Aikiyo
patent: 6404786 (2002-06-01), Kondo et al.
patent: 2002/0100914 (2002-08-01), Yoshida
patent: 655813 (1995-05-01), None
patent: 2003-298170 (2003-10-01), None

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