Light emitting chip package and light source module

Details Light emitting chip package and light source module Light emitting chip package and light source module

2007-05-09

2008-12-02

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S678000, C257S099000, C257SE33058

Reexamination Certificate

active

07459783

ABSTRACT:
A light emitting chip package having a carrier, at least one light emitting chip and a thermal enhanced cover is provided. The carrier includes a plurality of through holes. The light emitting chip is disposed on the carrier. The light emitting chip has an active surface, a back surface opposite to the active surface and a plurality of bumps disposed on the active surface. The light emitting chip is electrically connected to the carrier through the bumps. The thermal enhanced cover is disposed on the carrier to expose at least one side of the light emitting chip. The thermal enhanced cover includes a cover body and a plurality of protrusions connected thereto. A portion of the cover body is above the back surface of the light emitting chip. The protrusions are respectively inserted through the through holes. Therefore, the thermal dissipation efficiency of the light emitting chip package is improved.

REFERENCES:
patent: 7230279 (2007-06-01), Kuo et al.
patent: 2004/0222433 (2004-11-01), Mazzochette et al.
patent: 2005/0233485 (2005-10-01), Shishov et al.
patent: 2006/0220036 (2006-10-01), Lee et al.

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