Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1990-10-24
1992-03-17
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 531, 427 541, 427125, 427123, 427124, 4272481, 427250, 427314, B05D 306, B05D 512, C23C 1606
Patent
active
050967371
ABSTRACT:
Chemical vapor deposition precursors for depositing copper, silver, rhodium and iridium metals on substrates comprise ligand stabilized +1 metal beta-diketonate coordination complexes of said metals. Uses of such precursors in CVD processes are also provided.
REFERENCES:
patent: 3356527 (1967-12-01), Moshier et al.
patent: 3438805 (1969-04-01), Potrafke
patent: 3625765 (1971-12-01), Potrafke
patent: 3700693 (1972-10-01), Cairncross et al.
patent: 3817784 (1974-06-01), Cairncross et al.
patent: 3933878 (1976-01-01), Ttyler et al.
patent: 4385005 (1983-05-01), Doyle
patent: 4425281 (1984-01-01), Doyle
patent: 4842891 (1991-06-01), Miyazaki et al.
patent: 5019531 (1991-05-01), Awaya
Appl. Phys. A 45, 151-154 (1988) Thin Copper Films by Plasma CVD Using Copper-Hexafluoro-Acetylacetonate by C. Oehr and H. Suhr.
Appl. Phys. Lett 46 (2), 15 Jan. 1985--Laser Chemical Vapor Deposition of Copper by F. A. Houle, C. R. Jones, T. Baum, C. Pico and C. A. Kovac.
Baum Thomas H.
Larson Carl E.
Reynolds Scott K.
Beck Shrive
International Business Machines - Corporation
King Roy V.
Stemwedel John A.
LandOfFree
Ligand stabilized +1 metal beta-diketonate coordination complexe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ligand stabilized +1 metal beta-diketonate coordination complexe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ligand stabilized +1 metal beta-diketonate coordination complexe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1474857