Lifting mechanism for integrated circuit fabrication systems

Details Lifting mechanism for integrated circuit fabrication systems Lifting mechanism for integrated circuit fabrication systems

2005-03-01

2005-03-01

Ridley, Richard (Department: 3651)

Material or article handling

Associated with semiconductor wafer handling

Including wafer charging or discharging means for vacuum...

Reexamination Certificate

active

06860710

ABSTRACT:
In one embodiment, a lifting apparatus in an integrated circuit fabrication system includes a sliding mechanism supporting a rotatable assembly and an actuator configured to vertically move the sliding mechanism. Among other advantages, the apparatus allows the rotatable assembly to be lifted and then rotated to allow access to interior components, for example. In one embodiment, the rotatable assembly comprises a lid of a process chamber.

REFERENCES:
patent: 4226208 (1980-10-01), Nishida et al.
patent: 5370745 (1994-12-01), Litteral
patent: 5407449 (1995-04-01), Zinger
patent: 5498294 (1996-03-01), Matsushita et al.
patent: 6059517 (2000-05-01), Begin
patent: 6135051 (2000-10-01), Begin
patent: 6149367 (2000-11-01), Begin
patent: 6395094 (2002-05-01), Tanaka et al.
patent: 6460424 (2002-10-01), Dubas et al.
patent: 6573198 (2003-06-01), Boonstra et al.
patent: 6607602 (2003-08-01), Granneman et al.
patent: 6663332 (2003-12-01), Sluijk et al.

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