Lifting and rinsing a wafer

Details Lifting and rinsing a wafer Lifting and rinsing a wafer

1999-02-09

2000-08-15

Coe, Philip R.

Cleaning and liquid contact with solids

Apparatus

With means to movably mount or movably support the work or...

134153, 134179, 134902, B08B 302

Patent

active

061020575

ABSTRACT:
A nozzle that extends telescopically upward is used to elevate a wafer without contacting the wafer. The nozzle includes a stationary hollow cylinder, closed at its lower end and open at its upper end, within which a spool is disposed to slide vertically. In its lowest position the spool is spaced from the closed bottom of the cylinder, and purified water is supplied under pressure to the space. A passage extends vertically through the spool, and the water is discharged at the upper end of the spool from the passage. As a wafer is lowered toward the upper end of the spool, the wafer partially impedes the discharge, increasing the pressure in the space below the spool. The increased pressure drives the spool and the wafer upward, but the wafer never comes into contact with the wafer because the discharge of water creates a protective cushion between them.

REFERENCES:
patent: 5169408 (1992-12-01), Satoh et al.
patent: 5421056 (1995-06-01), Tateyama et al.
patent: 5591262 (1997-01-01), Sago et al.
patent: 5954072 (1999-09-01), Matusita
patent: 5979475 (1999-11-01), Satoh et al.

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