Cleaning and liquid contact with solids – Processes – With treating fluid motion
Reexamination Certificate
2005-11-08
2005-11-08
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
With treating fluid motion
C216S040000, C438S906000
Reexamination Certificate
active
06962630
ABSTRACT:
A lift-off procedure is provided which enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure. A wafer having a surface on which a pattern is formed which contains a pattern portion to be removed is soaked into a chemical liquid at an angle at which the surface faces downward.
REFERENCES:
patent: 5908042 (1999-06-01), Fukunaga et al.
patent: 05-062962 (1993-03-01), None
patent: 10-004093 (1998-01-01), None
Nitta Yoshiki
Ohmuro Kazuhiko
Suzuki Masaru
Kornakov M.
Oki Electric Industry Co. Ltd.
Rabin & Berdo P.C.
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