Lids for wafer-scale optoelectronic packages

Details Lids for wafer-scale optoelectronic packages Lids for wafer-scale optoelectronic packages

2006-05-16

2006-05-16

Loke, Steven (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257S100000, C257S432000, C257S433000, C257S434000, C372S043010

Reexamination Certificate

active

07045827

ABSTRACT:
A lid for a wafer-scale package includes a body having a bond area around a cavity defined by the body, an oxide layer atop the bond area and the cavity, and a reflective layer atop the oxide layer. The cavity has an angled sidewall where a portion of the reflective layer over the angled sidewall forms a mirror for reflecting a light. The lid further includes a solder layer atop another portion of the reflective layer over the bond area, and a barrier layer atop the mirror. The barrier layer is solder non-wettable so it prevents the solder layer from wicking into the cavity and interfering with the mirror. The barrier layer is also transparent to the light and has a thickness that either does not affect the light reflection or improves the light reflection.

REFERENCES:
patent: 3657029 (1972-04-01), Fuller
patent: 4773972 (1988-09-01), Mikkor
patent: 4791075 (1988-12-01), Lin
patent: 5336928 (1994-08-01), Neugebauer et al.
patent: 6696645 (2004-02-01), Margomenos et al.
patent: 6818464 (2004-11-01), Heschel

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