Lidless chip package effectively having co-planar frame and...

Details Lidless chip package effectively having co-planar frame and... Lidless chip package effectively having co-planar frame and...

2006-04-18

2006-04-18

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S717000

Reexamination Certificate

active

07030484

ABSTRACT:
A “lidless” integrated circuit package includes a support member that is arranged to support at least part of a load placed on the integrated circuit package. The support member has or is connected to a flexible support device that is in supportive contact with the load and that is designed to flex dependent on a position of the support member. The flexible support device substantially ensures that a plane of the surface of the flexible support device and a plane of a surface of a semiconductor die of the integrated circuit package are co-planar, thereby leading to a desirable load distribution within the integrated circuit package.

REFERENCES:
patent: 6501658 (2002-12-01), Pearson et al.
patent: 2002/0137369 (2002-09-01), Edwards et al.
patent: 2003/0085453 (2003-05-01), Eyman et al.

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