Lid wafer bond packaging and micromachining

Details Lid wafer bond packaging and micromachining Lid wafer bond packaging and micromachining

1998-05-06

1999-06-22

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438113, 438106, H01L 2144, H01L 2148, H01L 2150

Patent

active

059151684

ABSTRACT:
A wafer level hermetically packaged integrated circuit has a protective cover wafer bonded to a semiconductor device substrate wafer. The substrate wafer may contain a cavity. The cover wafer seals integrated circuits and other devices including but not limited to air bridge structures, resonant beams, surface acoustic wave (SAW) devices, trimmable resistors, and micromachines. Some devices, such as SAWs, are formed on the surface of cavities formed in the protective cover wafer. Die are separated to complete the process.

REFERENCES:
patent: 4990814 (1991-02-01), Tanski et al.
patent: 5059848 (1991-10-01), Mariani
patent: 5567656 (1996-10-01), Chun
patent: 5583373 (1996-12-01), Ball et al.
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5604160 (1997-02-01), Warfield
patent: 5610431 (1997-03-01), Martin
European Search Report, Application No. EP 97 11 4496, Dated: Mar. 19, 1998 .

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