Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-28
2006-11-28
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
07142435
ABSTRACT:
A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10–500 μm and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.
REFERENCES:
patent: 5608188 (1997-03-01), Choon et al.
patent: 5838551 (1998-11-01), Chan
patent: 6758387 (2004-07-01), Zen
patent: 6867982 (2005-03-01), Ito et al.
patent: 2002/0121072 (2002-09-01), Yoshino et al.
patent: 02244658 (1990-09-01), None
patent: 11191601 (1999-07-01), None
Azuma Takenori
Goto Masaaki
Nakajima Misao
Nishiuchi Fumiaki
Taniguchi Sanae
Carpio Ivan
Cuneo Kamand
Senju Metal Industry Co. Ltd.
Tobias Michael
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