Lid attachment mechanism

Details Lid attachment mechanism Lid attachment mechanism

2007-03-29

2010-12-28

DeCady, Albert (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

Reexamination Certificate

active

07860599

ABSTRACT:
Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates.

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Sutcliffe, Roger; “Receptacle Carriers Promote Efficient Assembly”; Mar. 15, 2005; Mill-Mae MFG. Corp. pp. 1.

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