Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Patent
1996-10-23
1998-06-09
Kincaid, Kristine L.
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
174 35GC, 361816, 361752, 361753, H05K 900
Patent
active
057638241
ABSTRACT:
A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference.
REFERENCES:
patent: 3885084 (1975-05-01), Kaiserswerth et al.
patent: 3953566 (1976-04-01), Gore
patent: 4385102 (1983-05-01), Fitzky et al.
patent: 4557957 (1985-12-01), Manniso
patent: 4575578 (1986-03-01), Bogan et al.
patent: 4857668 (1989-08-01), Buonanno
patent: 4912594 (1990-03-01), Bannink, Jr. et al.
patent: 4967315 (1990-10-01), Schelhorn
patent: 5202536 (1993-04-01), Buonanno
patent: 5269810 (1993-12-01), Hull et al.
patent: 5407865 (1995-04-01), Glovatsky et al.
patent: 5566055 (1996-10-01), Salvi, Jr.
Patent Abstracts of Japan vol. 017, No. 009 (E-1303) 8 Jan. 1993 & JP, A, 04 242 010 (Sony Chem Corp) 28 Aug. 1992.
King David Robert
Reis Bradley E.
Rowan Joseph C.
Genco, Jr. Victor M.
Kincaid Kristine L.
Ngo Hung V.
W. L. Gore & Associates, Inc.
LandOfFree
Lid assembly for shielding electronic components from EMI/RFI in does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lid assembly for shielding electronic components from EMI/RFI in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lid assembly for shielding electronic components from EMI/RFI in will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2202501