Lid assembly for hermetic sealing of a semiconductor chip

Details Lid assembly for hermetic sealing of a semiconductor chip Lid assembly for hermetic sealing of a semiconductor chip

1981-03-13

1982-05-25

Hall, George T.

Receptacles

Closures

29588, 174 52S, 174 52FP, 252514, 219 87, B65D 728, B65D 640, B65D 3900

Patent

active

043312535

ABSTRACT:
A lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a flowed solderable layer in the hermetic sealing area.

REFERENCES:
patent: 3874549 (1975-04-01), Hascoe
patent: 4109818 (1978-08-01), Hascoe et al.
patent: 4192433 (1980-03-01), Hascoe

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