Electrical connectors – With coupling movement-actuating means or retaining means in... – For dual inline package
Reexamination Certificate
2000-07-25
2001-08-28
Nguyen, Khiem (Department: 2839)
Electrical connectors
With coupling movement-actuating means or retaining means in...
For dual inline package
C361S704000, C361S710000
Reexamination Certificate
active
06280222
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electrical connector, and particularly to an electrical Land Grid Array (LGA) socket.
2. Description of the Related Art
Due to the ever increasing speed of microprocessors, there is an ever more pressing need to simplify the bottom surface of microprocessors by removing pins thereunder. A type of microprocessor exists which is called a leadless (/pinless) grid package, which is referred to by the acronym LGP. This technology has also been called land grid array or pinless grid array, and is identified by the acronym LGA.
These LGPs are usually used with heat sinks clamped tightly against them to physically conduct away the heat they generate and to dissipate the heat into the surrounding air. The heat sinks are pretty massive and must withstand rigorous environmental and handling requirements. The most common method (perhaps the only method) used to clamp the heat sinks in place is to fasten the heat sink directly to a printed circuit board using screws, nuts and washers, the LGP being connected to the circuit board directly beneath the heat sink. This approach is cumbersome to implement and there is always the risk that some small electrically conductive elements may get lost inside the computer, either during assembly or during replacement of the LGPs and the heat sinks. Furthermore, a tool is usually needed to assemble or replace the LGP and the heat sink and the tool is expensive and makes the procedure time-consuming.
Therefore, an improved connection device is required to overcome the disadvantages mentioned above.
SUMMARY OF THE INVENTION
A first object of the present invention is to provide an electrical Land Grid Array (LGA) socket which comprises a reliable securing mechanism for mounting a Land Grid Package (LGP) and a heat sink onto a printed circuit board; and
Another object of the present invention is to provide an electrical LGA socket which reliably secures an LGP and a heat sink and which eliminates the use of an external tool during assembly or replacement of the LGP and the heat sink.
An electrical LGA socket in accordance with the present invention for mounting an LGP and a heat sink onto a printed circuit board comprises a frame portion mechanically mountable to the printed circuit board and a connector portion electrically connecting the LGP with the printed circuit board. The heat sink comprises a first flange and a second flange opposite to the first flange. The frame portion comprises a generally rectangular stationary element for receiving the connector portion, the LGP and the heat sink, and a driver pivotally assembled to the stationary element and cooperating with the stationary element to secure the LGP and the heat sink. The stationary element comprises a first and second retainers disposed at one side thereof and a projection opposite to the first and second retainers to secure the second flange of the heat sink. The driver comprises a lever, a shaft assembled to the lever and a follower assembled to the shaft. The shaft extends through the first retainer and the follower and is received by the second retainer. The shaft and the follower are rotatable in response to rotation of the lever. The follower is disposed in a space defined between the first and second retainers to secure the second flange of the heat sink.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
is a perspective view of an electrical LGA socket in accordance with a first embodiment of the present invention, with an LGP and a heat sink locked in position, wherein the LGP is beneath the heat sink and is not visible;
FIG. 2
is a perspective view of a driver of the socket of
FIG. 1
;
FIG. 3
is an enlarged cross-sectional view taken along line III—III of
FIG. 1
;
FIG. 4
is similar to
FIG. 1
, but the socket is in an intermediate position between a closed position and an open position thereof;
FIG. 5
is a side elevational view of the socket in the open position, wherein the heat sink is removed from and positioned above the socket and the LGP and a connector portion are shown in dotted lines;
FIG. 6
is an enlarged cross-sectional view of the driver of the LGA socket in the open position;
FIG. 7
is similar to
FIG. 6
but the LGA socket is in the intermediate position;
FIG. 8
is similar to
FIG. 6
but the LGA socket is in the closed position;
FIG. 9
is a perspective view of the heat sink with a second flange thereof shown; and
FIG. 10
is similar to
FIG. 1
but illustrates a second embodiment of the present invention.
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Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Nguyen Khiem
Zarroli Michael C.
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