Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2007-01-30
2007-01-30
Soward, IDA M. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S726000, C257S727000, C257S735000, C257S736000, C257S737000, C257S780000, C257S781000
Reexamination Certificate
active
11078957
ABSTRACT:
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. A grounding clip surrounds the housing and is conductively connected to the substrate, and has spring arms which are connectable to heat sink hardware on one side thereof and to a printed circuit board on the other side.
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Trout David A
Whyne Richard N
Soward IDA M.
Tyco Electronics Corporation
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