Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2003-09-02
2004-06-08
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06746253
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an integrated circuit (IC) socket connector, and more particularly to a land grid array (LGA) socket connector with reinforcing members.
2. Description of the Prior Art
With the trend toward miniaturization of electrical components, this enables dielectric components for receiving the electrical components to be correspondingly miniature. Further, the dielectric components are commonly formed from dielectric materials of low rigidness and relatively easily deform. Thus this unexpected deformation decreases reliability of mechanical and electrical engagement between the electrical components.
A typical LGA socket connector is one kind of the miniature electrical and dielectric components. U.S. Pat. No. 6,164,978 discloses an LGA socket connector. Referring to
FIG. 4
, the LGA socket connector
8
comprises a substantially rectangular base
80
, and a plurality of terminals
82
received in the base
80
. A rectangular opening
804
is defined in the base
80
, for receiving an IC package
7
therein. Four side walls
802
are formed on the base
80
, and cooperatively defines the opening
804
. A resilient first arm
8040
extends from one side wall
802
into the opening
804
. Two spaced resilient second arms
8020
extend from one adjacent side wall
802
into the opening
804
.
Referring to
FIG. 5
, in assembly, when the IC package
7
is placed in the opening
804
of the base
80
, the second arms
8020
generate resilient force to hold the IC package
7
, and the first arm
8040
only generates relatively little resilient force to facilitate positioning the IC package
7
in the opening
804
. Thus the first and second arms
8040
,
8020
cooperatively secure the IC package
7
in the opening
804
. As a result, mechanical and electrical engagement between the terminals
802
and corresponding pads (not shown) of the IC package
7
is attained.
Referring to
FIG. 6
, with the second arms
8020
pressing on a side of the IC package
7
, a counterforce “F” respectively presses upon two opposite inner sides of side walls
802
of the base
80
in opposite directions. Thus the base
80
is liable to bend along a direction “R”. If this happens, some terminals
82
disposed at opposite bending ends of base
80
may not fully engage with the corresponding pads of the IC package
7
. Uniform engagement between the terminals
82
and the corresponding pads of the IC package
7
is destroyed, and even open electrical circuits are formed therebetween. Thus reliability of mechanical and electrical engagement between the terminals
82
and the corresponding pads of the IC package
7
is decreased.
FIG. 7
discloses another kind of typical LGA socket connector
9
, which comprises a base
90
, a plurality of terminals (not shown) received in the base
90
, a cover
92
pivotally attached to the base
90
, an actuator member
93
rotatably mounted on the base
90
, and a retention frame
91
mounted on the base
90
. The actuator member
93
is disposed at one end of the base
90
, and the cover
92
is pivoted at an opposite end of the base
90
. With this structure, in use, a position portion (not labeled) of the actuator member
93
is adopted to resiliently press an extending portion (not labeled) of the cover
92
so as to position the cover
92
on the base
90
. Thus mechanical and electrical engagement between the terminals and corresponding pads of an IC package (not shown) is attained. By this positioning means, the base
90
has a trend of warping upwardly at said opposite ends thereof.
The retention frame
91
is formed from a sheet of metal material, and has a good rigidness. With the retention frame
91
being mounted on the base
90
, the rigid retention frame
91
prevents the base
90
from warping upwardly at said opposite ends thereof. Thus reliable engagement between the terminals and the corresponding pads of the IC package is assured.
In essence, the base
90
has a trend of warping upwardly only at said opposite ends thereof. Thus only two opposite laterals (not labeled) of the retention frame
91
are used to prevent the base
90
from warping upwardly at he opposite ends thereof. However, the retention frame
91
has four sides. The four sides cooperatively define an opening (not labeled). With this structure, when the retention frame
91
is formed from the sheet of metal material, much metal material may be wasted, this inflates manufacturing costs of the retention frame
91
.
Accordingly, there is a need to provide an improved LGA socket connector to overcome the above-mentioned problems.
SUMMARY OF THE INVENTION
Accordingly, a main object of the present invention is to provide an LGA socket connector with two reinforcing members able to both reinforce a base of the socket connector and lower manufacturing costs thereof. thereof.
To fulfill the above-mentioned object, an LGA socket connector comprises a rectangular base, a plurality of terminals received in the base, and two reinforcing members attached to the base. Tow side walls are defined on opposite ends of the base. Each reinforcing member has an elongate base plate, a first side plate bent perpendicularly inwardly from a top edge portion of the base plate and a second side plate bent perpendicularly inwardly from a bottom edge portion of the base plate. With this configuration, the reinforcing member is formed from a sheet of metal with very little wastage. Further, the reinforcing member has a “C”-shaped cross-section. Thus said reinforcing member can attain a good rigidness along a length thereof. The two reinforcing members are respectively attached to said side walls, the base is thereby effectively reinforced.
REFERENCES:
patent: 4204722 (1980-05-01), Yasui et al.
patent: 6210176 (2001-04-01), Hsiao
patent: 6375476 (2002-04-01), Goodwin et al.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Ta Tho D.
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