Levitated reticle-masking blade stage

Details Levitated reticle-masking blade stage Levitated reticle-masking blade stage

2008-05-13

2008-05-13

Kim, Peter B. (Department: 2851)

Photocopying

Projection printing and copying cameras

Illumination systems or details

C355S075000

Reexamination Certificate

active

11218620

ABSTRACT:
A method, apparatus, and system for controlling a reticle-masking blade in a photolithography system. A reticle-masking blade is supported with a reticle-masking blade carriage assembly. The reticle-masking blade carriage assembly is levitated at a position with respect to a reference frame and at an orientation with respect to the reference frame. Preferably, the reticle-masking blade carriage assembly is electromagnetically levitated. At least one of the position and the orientation of the reticle-masking blade carriage assembly is measured. At least one of the position and the orientation of the reticle-masking blade carriage assembly is controlled. Optionally, the reticle-masking blade carriage assembly is moved within a dimension within a range defined by the reference frame. The dimension can be two dimensions. The movement of the reticle-masking blade carriage assembly can be controlled.

REFERENCES:
patent: 4952858 (1990-08-01), Galburt
patent: 5486896 (1996-01-01), Hazama et al.
patent: 5663783 (1997-09-01), Ueda
patent: 5747780 (1998-05-01), Shioyama et al.
patent: 5900707 (1999-05-01), Wakui
patent: 6040893 (2000-03-01), Ebinuma
patent: 6069418 (2000-05-01), Tanaka
patent: 6259509 (2001-07-01), Miwa et al.
patent: 6262797 (2001-07-01), Horikawa
patent: 6271606 (2001-08-01), Hazelton
patent: 6307619 (2001-10-01), Galburt et al.
patent: 6359678 (2002-03-01), Ota
patent: 6429561 (2002-08-01), Davis et al.
patent: 6437463 (2002-08-01), Hazelton et al.
patent: 6509957 (2003-01-01), Tanaka
patent: 6597002 (2003-07-01), Kondo
patent: 6781669 (2004-08-01), Tanaka
patent: 2001/0055733 (2001-12-01), Irie et al.
patent: 2002/0011759 (2002-01-01), Adams et al.
patent: 2004/0043198 (2004-03-01), Froebel et al.
patent: 2004/0160132 (2004-08-01), Carter et al.
patent: 2004/0160203 (2004-08-01), Carter et al.
patent: 11-026379 (1999-01-01), None
patent: 11-233399 (1999-08-01), None
patent: WO99/63585 (1999-12-01), None
U.S. Appl. No. 10/366,444, filed Feb. 14, 2003, Carter et al.
U.S. Appl. No. 10/449,001, filed Jun. 2, 2003, Galburt et al.
“Lithography,”International Roadmap for Semiconductors, 2001 Edition, pp. 1-17.
Semiconductor Manufacturing Process, <1 page (visited Feb. 27, 2002).
Overview of Align/Expose/Develop Steps, 1 page, from http://www.ee.washington.edu/research/microtech/cam/PROCESSES/Photolithography/ph..., (visited Aug. 25, 2002).
Photoresist Spin Coating, 1 page from http://www.ee.washington.edu/research/microtech/cam/PROCESSES/Photolithography/ph..., (visited Aug. 25, 2002).
Photolithography, 1 page, from http://www.ee.washington.edu/research/microtech/cam/PROCESSES/Photolithography/ph..., (visited Aug. 25, 2002).
How Chips are Made, 4 pages, from http://www.elume.com/howchips.html,(visited Aug. 25, 2002).
Extreme Ultraviolet Lithography: Imaging the Future, 12 pages, from http://www.llnl.gov/str/Sween.html, (visited Aug. 27, 2002).
EUV Lithography(EUVL), 2 pages, from http://student.science.nus.edu.sg/˜sci70806/euv.html, (visited Aug. 27, 2002).
EUV Engineering Test Stand, 2 pages.
Powell, F.R. and Johnson, T.A., “Filter windows for EUV lithography,” 3 pages.
Mercer, I.P. et al., “EUV light source and laser considerations for scalability and high-energy conversion efficiency,”SPIE's International Symposium: High-Power Laser Ablation 2002, Paper No. 4760-76, 11 pages, (Apr. 21-26, 2002).
Keeping the “More” in Moore's Law, 4 pages, from http://www.llnl.gov/str/Sweeney.html, (visited Aug. 27, 2002).
Gwyn, C., “EUV lithography: The timeline puts the screws to extreme ultraviolet lithography, but engineers rise to the challenge,” 6 pages, from http://oemagazine.com/fromTheMagazine/jun02/euv.html, (Jun. 2002).
English machine translation of JP11-233399 A, as available at the website of Japanese Patent Office, Aug. 1999.
English machine translation of JP11-026379, as available at the website of Japanese Patent Office, Jan. 1999.

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