Fishing – trapping – and vermin destroying
Patent
1994-03-21
1996-01-09
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
156344, 437226, H01L 21304, B32B 3118
Patent
active
054828996
ABSTRACT:
An apparatus and method are disclosed that prevent the breakage of semiconductor wafers that have not been entirely sawed, during the process of removing dicing tape from the back of the wafer. In addition, an improved semiconductor demounter is disclosed that allows optimum positioning of the semiconductor wafer for removal of the dicing tape. The apparatus for preventing breakage of semiconductor wafers consists of a leveling block 32 for use with a semiconductor demounter 16 having an incline 18 leading up to a tape removal apparatus 20. The leveling block 32 comprises an declined plane 34 with an angle of declination 36 approximately equal to the angle of inclination 26 of the incline leading up to the tape removal apparatus 20. The declined plane 34 rests on top of the incline 18 leading up to the tape removal apparatus 20, thereby forming a substantially level surface leading into the tape removal apparatus 20 and allowing the dicing tape 12 to be removed from the surface of a semiconductor wafer 10 while reducing the likelihood of breaking the wafer 10. The leveling block 32 includes one or more fastening points 38 for affixing the block to a semiconductor demounter.
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Model 2010 Die Demounter Operator's Manual, Revision 3, Viking Semiconductor Equipment, Inc. May, 1988.
Baxter Michael G.
McKenna Robert G.
Chaudhuri Olik
Donaldson Richard L.
Grossman Rene E.
Mulpuri S.
Reed Julie L.
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