Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Reexamination Certificate
2006-10-31
2006-10-31
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal coating
C205S297000, C205S298000, C106S001260
Reexamination Certificate
active
07128822
ABSTRACT:
Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and methods are useful for providing a planarized layer of copper on a substrate having small apertures. The compositions and methods provide complete fill of small apertures with reduced void formation.
REFERENCES:
patent: 3328273 (1967-06-01), Creutz et al.
patent: 4038161 (1977-07-01), Eckles et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4376685 (1983-03-01), Watson
patent: 4555315 (1985-11-01), Barbieri et al.
patent: 5232575 (1993-08-01), Dodd
patent: 5607570 (1997-03-01), Rohbani
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6024857 (2000-02-01), Reid
patent: 6183622 (2001-02-01), Janik
patent: 6361823 (2002-03-01), Bokisa et al.
patent: 6425996 (2002-07-01), Dahms et al.
patent: 6444110 (2002-09-01), Barstad et al.
patent: 6610192 (2003-08-01), Step et al.
patent: 1151159 (1963-04-01), None
patent: 196 43 091 (1998-04-01), None
patent: 1 069 211 (2001-01-01), None
patent: 1 526 076 (1978-09-01), None
patent: 10-102278 (1998-04-01), None
patent: WO 99/31300 (1999-06-01), None
Mikkola Robert D.
Wang Deyan
Wu Chunyi
Cairns S. Matthew
Shipley Company L.L.C.
LandOfFree
Leveler compounds does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Leveler compounds, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leveler compounds will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3685901