Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Amplitude control
Reexamination Certificate
2001-02-20
2003-04-29
Le, Dinh T. (Department: 2816)
Miscellaneous active electrical nonlinear devices, circuits, and
Signal converting, shaping, or generating
Amplitude control
C327S437000
Reexamination Certificate
active
06556061
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to digital integrated circuits, and more particularly, to a circuit that allows a digital signal to be level shifted from a low voltage supply to a high voltage supply.
2. Description of the Prior Art
Ultra deep submicron CMOS technologies are used to create digital integrated circuits with very high transistor densities and very high switching speeds. These submicron CMOS transistors have very thin gate oxide and very low threshold voltages. To facilitate use of ultra deep submicron CMOS processes, the supply voltage for the high density logic core must be lowered to improve device reliability. Supply voltages of between about 2.5 Volts and 3.3 Volts, which have been typical for prior art CMOS logic devices, have to be reduced to a low voltage regime of, for example, between about 0.9 Volts and 2.5 Volts.
While the supply voltage of the core logic section is being reduced, the supply voltage for the input/output section of the integrated circuit must be kept at a higher level to assure adequate signal-to-noise ratio and compatibility with other devices. Where digital signals in the low voltage core must be transmitted off the integrated circuit, signal level shifting is therefore necessary. A level shifting circuit is used to increase the upper voltage swing of the low voltage signal, from a low voltage to a high voltage.
Referring now to
FIG. 1
, a prior art level shifting circuit is shown. This level shifting circuit uses four types of transistors. Low voltage NMOS transistors
10
and low voltage PMOS transistors
14
are used in the low supply voltage VCCL
34
section. High voltage NMOS transistors
18
and high voltage PMOS transistors
22
are used in the high supply voltage VCCH section. The low voltage transistors
10
and
14
have a thinner gate oxide than the high voltage transistors
18
and
22
. In addition, the low voltage transistors
10
and
14
have a low threshold voltage of between about 0.2 Volts and 0.35 Volts for NMOS
10
and between about −0.2. Volts and −0.35 Volts for PMOS
14
. High voltage devices have a threshold voltage of between about 0.4 Volts and 0.7. Volts for NMOS
18
and between about −0.4 Volts and −0.7 Volts for PMOS
22
.
The prior art level shifting circuit uses an inverter made up of transistors MN
1
46
and MP
1
50
and a differential pair made up of transistors MN
2
54
, MN
3
58
, MP
2
62
, and MP
3
66
. Generally, the low voltage supply VCCL
34
is biased at between about 0.9 Volts and 2.5 Volts. The high voltage supply VCCH
42
is biased at between about 3 Volts and 5 Volts. The purpose of the level shifting circuit is to convert the input signal IN
26
from a swing of between 0 Volts and VCCL
34
to a swing of between 0 Volts and VCCH
42
at the output node OUT
30
.
The prior art level shifting circuit exhibits dc voltage and transistor switching characteristics according to Table 1 below:
TABLE 1
IN
INB
OUT
OUTB
MN1
MP1
MN2
MN3
MP2
MP3
VSS
VCCL
VSS
VCCH
OFF
ON
OFF
ON
ON
OFF
VCCL
VSS
VCCH
VSS
ON
OFF
ON
OFF
OFF
ON
Note that the prior art level shifting circuit exhibits no dc static current consumption. Since the input signal IN
26
only connects to the gates of transistors MN
1
46
, MP
1
50
, and MN
2
54
, there is no dc input leakage path. Only one of the inverter pair MN
1
46
and MP
1
50
is ON in either state. Therefore, there exists no static current path from VCCL
34
to VSS
38
. Finally, since only one of the pair MN
2
54
and MP
3
66
or the pair MN
3
58
and MP
2
62
are ON at any given time, there exists no static current path between VCCH and VSS.
Note also that the high supply voltage VCCH is only applied to the thick oxide devices MN
2
54
, MN
3
58
, MP
2
62
and MP
3
66
. Therefore, reliability concerns for the thin oxide devices are eliminated.
To illustrate the ac performance of the prior art level shifting circuit, consider the case of the input signal IN
26
switching from VSS to VCCL. First, transistor MN
2
54
turns ON. At this point, transistor MP
2
62
remains ON. Therefore, while MN
2
54
is driving node OUTB
28
to VSS, MP
2
62
is concurrently driving node BUTB
28
to VCCL. After transistor MP
1
50
turns OFF, the inverter output INB
27
transitions to VSS. Transistor MN
3
58
is therefore turned OFF. Finally, once the voltage at node OUTB
28
is discharged, transistor MP
3
66
is turned ON. MP
3
66
drives the output node OUT
30
to VCCH and turns OFF MP
2
62
.
An analysis of the ac operation of the prior art level shifting circuit reveals a serious switching delay when the design is used in an ultra-deep submicron process. In such processes, the VCCL
34
voltage is very small to facilitate the usage of very small devices with very thin gate oxides, shallow junctions, and shrinking threshold voltages. However, the key input transistors of the circuit, MN
2
54
and MN
3
58
, still have large voltage thresholds. Therefore, the I
dsat
of these thick gate NMOS devices MN
2
54
and MN
3
58
, at the relatively small gate drive of VCCL, is also small. If, as in the example case, MN
2
54
must drive node OUTB
28
against MP
2
62
, then the reduced I
dsat
of MN
2
54
will cause the OUTB signal transition to take a long time.
In addition, since OUTB
28
initially remains at or near VCCH
42
, transistor MP
3
66
is OFF. At the same time, transistor MN
3
58
is in the off-state once INB
27
discharges to VSS. In this condition, the output node OUT
30
is floating. The voltage level of OUT
30
will depend on the load and the reverse saturation current of the MP
3
66
drain-to-N Well and the MN
3
58
drain-to-P Well junction diodes during the transition time prior to MN
2
54
discharging OUTB
28
to VSS.
Finally, the I
dsat
of MN
2
54
and of MN
3
58
may be made larger than the I
dsat
of MP
2
62
and of MP
3
66
by making MN
2
and MN
3
sufficiently large to overcome the relatively small gate drive. However, this adds substantially to the area required for the level shifting circuit. In addition, the parasitic capacitance from the gate of MP
3
66
and the drain junction of MP
2
62
must be discharged by MN
2
54
during a transition.
Several prior art inventions describe circuits for level shifting and handling higher voltage supplies in low voltage CMOS applications. U.S. Pat. No. 6,043,699 to Shimizu describes level shifting circuits with higher speed or with extended operating ranges. U.S. Pat. No. 6,043,698 to Hill teaches a level shifting circuit using a latch and resistors in the interface section. U.S. Pat. No. 5,892,371 to Maley discloses a level shifting circuit configured to protect MOS transistors from gate oxide failure by limiting the voltage across any one transistor. U.S. Pat. No. 5,729,155 to Kobatake describes a level shifting circuit where an NMOS transistor and a PMOS transistor are connected in series between the top rail PMOS transistor and the bottom rail NMOS transistor. The additional transistors are biased to fixed voltage references to insure that each device is ON. The presence of the transistor pair reduces the voltage stress on each device in the stack. U.S. Pat. No. 5,539,334 to Clapp, III et al discloses a circuit, comprising low voltage components, that can be used with a high voltage supply. The level shifting circuit embodiment may accommodate multiple power supplies. However, Clapp, III et al, has serious drawbacks for submicron application because diode
56
(
FIG. 3
) will turn on when VCC
1
is higher than the output voltage. Therefore, the output voltage cannot be pulled all the way down to VSS and the circuit will leak dc current.
U.S. Pat. No. 5,821,800 to Le et al teaches a level shifting circuit capable of high voltage operation using low voltage CMOS devices. One or more complementary NMOS and PMOS pairs are used between the top rail PMOS and the bottom rail NMOS transistors. The complementary devices are not self-biased. U.S. Pat. No. 5,153,451 to Yamamura et al describes a level shifting circuit that has a fail-safe mode. The output state is
Chen Chung-Hui
Wang Wen-Tai
Ackerman Stephen B.
Le Dinh T.
Saile George O.
Schnabel Douglas R.
Taiwan Semiconductor Manufacturing Company
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