LED with conductively joined bonding structure

Details LED with conductively joined bonding structure LED with conductively joined bonding structure

2009-11-09

2011-12-13

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C257S094000, C257S103000

Reexamination Certificate

active

08076670

ABSTRACT:
An LED is disclosed that includes a conductive submount, a bond pad having a total volume less than 3×10−5mm3conductively joined to the submount, a first ohmic contact on the bond pad opposite from the submount, an epitaxial region comprising at least a p-type layer and an n-type layer on the first ohmic contact, and an electrode to the epitaxial region opposite from the first ohmic contact.

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