LED printing array fabrication method

Details LED printing array fabrication method LED printing array fabrication method

1985-05-02

1986-05-13

Roy, Upendra

Metal working

Plural diverse manufacturing apparatus including means for...

Common reciprocating support for spaced tools

29576B, 148 15, 148175, H01L 736

Patent

active

045877173

ABSTRACT:
The method of fabricating Light Emitting Diodes (LEDs) with supporting circuits on a silicon chip or wafer for a Full Width Array (FWA) in which the silicon substrate or chip is first coated with Silicon Dioxide to form a thin film layer, a plurality of holes corresponding in number and configuration to the desired array are next opened in the layer, Gallium Phosphide LEDs together with p-n junctions and contact layers are then grown epitaxially in the holes, and finally attendant LED operating circuits are epitaxially formed on the silicon chip together with operative connections to the individual LEDs by Integrated Circuit techniques.

REFERENCES:
patent: 4211586 (1980-07-01), Fang et al.
patent: 4280273 (1981-07-01), Vincent
patent: 4335501 (1982-06-01), Wickenden et al.
patent: 4455562 (1984-06-01), Dolan et al.
Pickar et al., IBM-TDB, 16(10) (1974) p. 3200.

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