LED packaging method using a screen plate

Details LED packaging method using a screen plate LED packaging method using a screen plate

2011-02-22

2011-02-22

Tsai, H. Jey (Department: 2895)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S106000, C438S112000, C438S127000, C257SE25032

Reexamination Certificate

active

07892868

ABSTRACT:
A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed.

REFERENCES:
patent: 7655486 (2010-02-01), Thompson et al.

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