LED packaging method

Details LED packaging method LED packaging method

2010-04-30

2011-10-25

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000, C438S028000, C438S034000, C977S742000, C257SE33056

Reexamination Certificate

active

08043875

ABSTRACT:
An LED packaging method provides a package that includes a substrate, a LED chip, a carbon naonotube thin film and an adhesive layer. The LED chip includes an anode and a cathode. The carbon naonotube thin film includes at least two electrically conductive areas spaced from each other. The anode and the cathode are electrically connected to the adjacent electrically conductive areas. The adhesive layer is coated on the LED chip and the carbon nanotube thin film.

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patent: 2008/0093975 (2008-04-01), Ryu et al.
patent: 2009/0061550 (2009-03-01), Kim et al.
patent: 2009/0072229 (2009-03-01), Suh et al.
patent: 2009/0184389 (2009-07-01), Bertin et al.
patent: 2009/0246901 (2009-10-01), Gilet et al.
patent: 2010/0171143 (2010-07-01), Paek et al.

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