Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2005-11-07
2008-12-30
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257S099000, C257SE51018
Reexamination Certificate
active
07470935
ABSTRACT:
An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.
REFERENCES:
patent: 6858880 (2005-02-01), Horiuchi et al.
patent: 2004/0061433 (2004-04-01), Izuno et al.
Lee Ming-Shun
Sung Ping-Ru
Monbleau Davienne
Taiwan Oasis Technology Co., Ltd.
Trinh Hoa B
Troxell Law Office PLLC
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