Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2009-09-15
2010-06-15
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S014000, C438S015000, C438S023000, C438S082000, C257SE21001, C257SE21088, C257SE33055, C257SE33056
Reexamination Certificate
active
07736920
ABSTRACT:
An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED chips. The positive electrode of each LED chip corresponds to at least two of the positive pads, and the negative electrode of each. LED chip corresponds to at least two of the negative pads. Every two wires of the conductive wire unit are respectively electrically connected between the positive electrode of each LED chip and one of the at least two positive pads and between the negative electrode of each LED chip and one of the at least two negative pads. The package unit has a translucent package resin body on the substrate body to cover the LED chips.
REFERENCES:
patent: 2005/0045904 (2005-03-01), Chen
patent: 2005/0087866 (2005-04-01), Shei et al.
patent: 2006/0208364 (2006-09-01), Wang et al.
Wu Chao-Chin
Yang Shen-Ta
Ahmadi Mohsen
Garber Charles D
Kile Goekjian Reed & McManus PLLC
Paragon Semiconductor Lighting Technology Co., Ltd.
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