LED package structure with concave area for positioning...

Details LED package structure with concave area for positioning... LED package structure with concave area for positioning...

2011-08-30

2011-08-30

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S024000, C438S026000

Reexamination Certificate

active

08008099

ABSTRACT:
An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.

REFERENCES:
patent: 6514782 (2003-02-01), Wierer et al.
patent: 2009/0302344 (2009-12-01), Inoguchi

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