LED package structure and method of packaging the same

Details LED package structure and method of packaging the same LED package structure and method of packaging the same

2005-12-14

2009-12-22

Lindsay, Jr., Walter L (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Encapsulated

C438S034000, C438S035000, C257SE33057, C257SE33059

Reexamination Certificate

active

07635876

ABSTRACT:
An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically connecting both the first and second electrode areas of the first LED chip with an external circuit.

REFERENCES:
patent: 2004/0129944 (2004-07-01), Chen

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