LED package structure and mass production method of making...

Details LED package structure and mass production method of making... LED package structure and mass production method of making...

2008-07-15

2008-07-15

Doan, Theresa T (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C438S022000, C257S081000, C257S099000

Reexamination Certificate

active

07399651

ABSTRACT:
An LED package structure includes a lower substrate, an upper substrate disposed on the lower substrate and having a though hole exposing a portion of the upper surface of the lower substrate; an individual LED unit disposed within the through hole in the upper substrate, a conductive pattern layer disposed on the upper substrate, a conducting wire interconnecting electrically the LED unit and the conductive pattern layer, and an encapsulating body disposed on the conductive pattern layer in such a manner that the encapsulating body hermetically encloses the LED unit, the through hole in the upper substrate and an inner peripheral portion of the conductive pattern layer surrounding the through hole. The lower and upper substrates are separately formed.

REFERENCES:
patent: 7098483 (2006-08-01), Mazzochette et al.
patent: 2006/0138436 (2006-06-01), Chen et al.

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