Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate
2007-01-09
2007-01-09
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With reflector, opaque mask, or optical element integral...
C257S079000, C257SE33067
Reexamination Certificate
active
11141023
ABSTRACT:
A power LED package module includes a frame, a chip heat-conductive support, a light-emitting chip and a package body. The frame has a conductive pin, and a support separated from the conductive pin and connecting to the chip heat-conductive support. The light-emitting chip is arranged on the chip heat-conducting support and electrically connected to the conductive pin. The frame, the chip heat-conducting support and the light-emitting chip are packaged via the package body. The chip heat-conducting support is partially exposed out of the package body for connecting to a heat-dissipating element for increasing the efficiency of heat dissipation of the power LED package module. The power LED package module thus provides electrical conduction and heat conduction in a split manner.
REFERENCES:
patent: 6274924 (2001-08-01), Carey et al.
patent: 2004/0126913 (2004-07-01), Loh
patent: 4335533 (1989-01-01), None
Birch & Stewart Kolasch & Birch, LLP
Flynn Nathan J.
Lite-On Technology Corporation
Quinto Kevin
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