Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate
2011-06-28
2011-06-28
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
C257SE33066, C257S079000, C257S433000, C438S026000, C313S512000
Reexamination Certificate
active
07968894
ABSTRACT:
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
REFERENCES:
patent: 4026008 (1977-05-01), Drees et al.
patent: 5040868 (1991-08-01), Waitl et al.
patent: 5208467 (1993-05-01), Yamazaki
patent: 5214495 (1993-05-01), Kitanishi
patent: 5807768 (1998-09-01), Shin
patent: 5814871 (1998-09-01), Furukawa et al.
patent: 5826980 (1998-10-01), Kouzu et al.
patent: 6274890 (2001-08-01), Oshio et al.
patent: 6682205 (2004-01-01), Lin
patent: 7119422 (2006-10-01), Chin
patent: 7361940 (2008-04-01), Kim et al.
patent: 7737463 (2010-06-01), Lee et al.
patent: 7763478 (2010-07-01), Loh et al.
patent: 7845828 (2010-12-01), Ku
patent: 7852015 (2010-12-01), Yen et al.
patent: 2001/0030866 (2001-10-01), Hochstein
patent: 2002/0113244 (2002-08-01), Barnett et al.
patent: 2002/0125494 (2002-09-01), Isokawa
patent: 2004/0075100 (2004-04-01), Bogner et al.
patent: 2004/0135156 (2004-07-01), Takenaka
patent: 2004/0251469 (2004-12-01), Yatsuda et al.
patent: 2005/0068776 (2005-03-01), Ge
patent: 2005/0199900 (2005-09-01), Lin et al.
patent: 2005/0236638 (2005-10-01), Tsukagoshi
patent: 2540685 (2003-03-01), None
patent: 2617939 (2004-05-01), None
patent: 2003-347588 (2003-12-01), None
patent: 2004-071771 (2004-03-01), None
patent: 2005-019662 (2005-01-01), None
Ahn Ho Sik
Hahm Hun Joo
Jeong Young June
Kim Bum Jin
Kim Hyung Suk
Chu Chris
Lowe Hauptman & Ham & Berner, LLP
Samsung Electro-Mechanics Co. Ltd.
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