LED package and method for producing the same

Details LED package and method for producing the same LED package and method for producing the same

2007-12-11

2007-12-11

Baumeister, B. William (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S100000, C257SE33055

Reexamination Certificate

active

11225068

ABSTRACT:
A method for producing an LED package is provided, the LED package includes an LED die, which has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode and a second electrode arranged on the non-light-emitting surface, a reverse-voltage protection member arranged on the non-light-emitting surface of the LED die, a conductive member electrically connecting the respective electrode of the LED die and the respective pole of the reverse-voltage protection member, and two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit. Wherein the reverse-voltage protection member has a first pole that is the first polarity and a second pole that is the second polarity; the polarity of each pole of the reverse-voltage protection member is opposite to that of the electrode of the LED die.

REFERENCES:
patent: 6593597 (2003-07-01), Sheu

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