LED package and method for producing the same

Details LED package and method for producing the same LED package and method for producing the same

2008-07-15

2008-07-15

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S099000, C257S100000, C257SE33068, C257S748000, C438S029000, C438S033000

Reexamination Certificate

active

07399996

ABSTRACT:
An LED package and method for producing the same are described. The LED package has an LED die with a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface. An insulation layer is formed on the conductive region-forming surface of the LED die, and has a plurality of openings corresponding to the conductive regions, respectively. A conductive member fills a respective opening, and is electrically connected a respective conductive regions to an exterior circuit.

REFERENCES:
patent: 6660550 (2003-12-01), Sato
patent: 2005/0194605 (2005-09-01), Shelton et al.

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