LED package and light source device using same

Details LED package and light source device using same LED package and light source device using same

2009-04-07

2011-11-29

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S432000, C257S434000, C257SE33058, C257SE33072

Reexamination Certificate

active

08067782

ABSTRACT:
An exemplary LED package includes a dielectric plate, a heat conductor, a first planar electrode and a second planar electrode, a LED chip, and metal wires. The dielectric plate comprises a receiving groove defined therein. The heat conductor is positioned in the dielectric plate opposite to the receiving groove, and the heat conductor comprises a holding portion exposed on bottom of the receiving groove. The first and second planar electrodes are respectively received in the dielectric plate extending to the receiving groove and are spaced from the heat conductor. The first and second electrodes are respectively electrically connected to the LED chip by the metal wires. The LED chip is mounted on the holding portion of the heat conductor.

REFERENCES:
patent: 7166873 (2007-01-01), Okazaki
patent: 2007/0215895 (2007-09-01), Amoh et al.
patent: 201004458 (2008-01-01), None

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