LED package and fabricating method thereof

Details LED package and fabricating method thereof LED package and fabricating method thereof

2006-07-20

2008-11-18

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257S712000, C257S099000, C257SE51018, C257SE33001

Reexamination Certificate

active

07453093

ABSTRACT:
The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

REFERENCES:
patent: 2004/0173808 (2004-09-01), Wu

Affiliated with

Also associated with

Rating

LED package and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LED package and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LED package and fabricating method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4029818