LED package

Details LED package LED package

2007-01-16

2007-01-16

Crane, Sara (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S098000

Reexamination Certificate

active

10834175

ABSTRACT:
An LED package includes a substrate, internal electrodes provided in an even (2n) number and formed on an upper surface of the substrate, external electrodes provided in the even (2n) number, formed on at least a part of surfaces of the substrate other than the upper surface of the substrate, and electrically connected to the corresponding internal electrodes, and LEDs provided in the even (2n) number, located on the upper surface of the substrate, and provided with an anode and a cathode. The anodes and cathodes of the LEDs are electrically connected to the internal electrodes such that the anode of each of the LEDs is connected to the anode of a neighboring one of the LEDs and the cathode of each of the LEDs is connected to the cathode of another neighboring one of the LEDs.

REFERENCES:
patent: 4241281 (1980-12-01), Morimoto et al.
patent: 6583447 (2003-06-01), Wang et al.
patent: 6667497 (2003-12-01), Huang et al.
patent: 50-107850 (1975-08-01), None
patent: 63-170142 (1988-11-01), None
patent: 5-25752 (1993-04-01), None
patent: 5-145117 (1993-06-01), None
patent: 2001-358371 (2001-12-01), None
patent: 2002-94122 (2002-03-01), None
patent: 2002-314138 (2002-10-01), None
patent: 2002-335019 (2002-11-01), None
Japanese Patent Office, Office Action, mailed Oct. 24, 2006.

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