Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2008-10-21
2011-12-13
Fahmy, Wael (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S713000, C257SE33059
Reexamination Certificate
active
08076692
ABSTRACT:
The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.
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Japanese Office Action, w/ English translation thereof, issued in Japanese Patent Application No. JP 2008-278485 dated Jul. 19, 2011.
Jung Suk Ho
Kim Hak Hwan
Kim Hyung Kun
Lee Young Jin
Paek Ho Sun
Fahmy Wael
McDermott Will & Emery LLP
Salerno Sarah
Samsung LED Co., Ltd.
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