LED of side view type and the method for manufacturing the same

Details LED of side view type and the method for manufacturing the same LED of side view type and the method for manufacturing the same

2007-10-04

2009-10-06

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S111000, C438S123000, C257SE23031

Reexamination Certificate

active

07598101

ABSTRACT:
A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (f) sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.

REFERENCES:
patent: 06-077540 (1994-03-01), None
patent: 16-207688 (2004-07-01), None
patent: 17-033122 (2005-02-01), None
patent: 10-0501202 (2005-01-01), None
International Search Report by Korean Intellectual Property Office on Feb. 1, 2007.

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