LED module and methods for producing and using the module

Details LED module and methods for producing and using the module LED module and methods for producing and using the module

2005-03-01

2005-03-01

Husar, Stephen (Department: 2875)

Illumination

Housing

With cooling means

C362S267000, C362S294000, C313S498000, C313S512000, C257S098000, C257S099000, C257S100000, C257S710000, C257S711000, C257S712000, C257S713000

Reexamination Certificate

active

06860621

ABSTRACT:
An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.

REFERENCES:
patent: 4399453 (1983-08-01), Berg et al.
patent: 5479029 (1995-12-01), Uchida et al.
patent: 5528474 (1996-06-01), Roney et al.
patent: 5782555 (1998-07-01), Hochstein
patent: 5836676 (1998-11-01), Ando et al.
patent: 5917245 (1999-06-01), Tomizawa
patent: 6060729 (2000-05-01), Suzuki et al.
patent: 6428189 (2002-08-01), Hochstein
patent: 6710377 (2004-03-01), Shimomura
patent: 2 315 709 (1974-10-01), None
patent: 40 25 163 (1991-07-01), None
patent: 42 19 132 (1993-12-01), None
patent: 197 14 659 (1998-10-01), None
patent: 0 921 568 (1999-06-01), None
patent: 2 276 032 (1994-09-01), None
patent: WO 9215458 (1992-09-01), None
patent: WO 9737385 (1997-10-01), None
patent: WO 9842628 (1998-10-01), None
patent: WO 0147039 (2001-06-01), None
Niina, T. et al.: “A High-Brightness GaP Green LED Flat-Panel Device for Character and TV Display”, IEEE Transactions on Electron Devices, vol. ED-26, No. 8, Aug. 1979, pp. 1182-1186.
Author not listed: “Superhelle Leuchtdioden erobern neue KFZ-Anwendungen, Power TOPLED ersetzen Kleinglühlampen”, [Extra Bright Light-Emitting Diode Conquers New Automobile Application, Power TOPLED Replaces Small Incandescent Lamps], Siemens, Components 34, No. 4, 1996, pp. 1-2.
Kish, F. A. et al.: “High Luminous Flux Semiconductor Wafer-Bonded AlGalnP/GaP Large-Area Emitters”, Electronics Letters, vol. 30, No. 21, Oct. 13, 1994, pp. 1790-1792.

Affiliated with

Also associated with

Rating

LED module and methods for producing and using the module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LED module and methods for producing and using the module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LED module and methods for producing and using the module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3430787