LED module and method of packaging the same

Details LED module and method of packaging the same LED module and method of packaging the same

2006-10-03

2006-10-03

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

C257S100000, C257SE25019, C257SE25028, C257SE25032

Reexamination Certificate

active

07115911

ABSTRACT:
An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.

REFERENCES:
patent: 4622433 (1986-11-01), Frampton
patent: 6746295 (2004-06-01), Sorg
patent: 2004/0099874 (2004-05-01), Chang et al.
patent: 2004/0173808 (2004-09-01), Wu
patent: 549603 (2003-08-01), None
patent: 578280 (2004-03-01), None
patent: 582122 (2004-04-01), None

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