Illumination – Light source and modifier – With ventilating – cooling or heat insulating means
Reexamination Certificate
2007-10-23
2007-10-23
Cariaso, Alan (Department: 2885)
Illumination
Light source and modifier
With ventilating, cooling or heat insulating means
C362S373000, C362S800000, C257S712000
Reexamination Certificate
active
11354674
ABSTRACT:
An LED light module assembly for use with high power, high light output LED's includes a thin flexible circuit board with surface mounted LED's and other electronic components which is attached to a metal heat sink using a layer of a thermally conductive adhesive, such as a thermally conductive epoxy adhesive. A conduction path is provided from the LED carrier through the flexible circuit board by the incorporation of one or more thermally conductive vias in the region of the attachment pad used to bond the LED to the flexible circuit board. These vias provide a conduction path from the back side of the LED carrier through the circuit board to the thermally conductive adhesive and heat sink. The LED light module assembly has the capacity to dissipate between about 10-14 W of power without exceeding a maximum LED junction temperature of about 125° C.
REFERENCES:
patent: 5552637 (1996-09-01), Yamagata
patent: 5857767 (1999-01-01), Hochstein
patent: 6045240 (2000-04-01), Hochstein
patent: 6375340 (2002-04-01), Biebl et al.
patent: 6392888 (2002-05-01), Chen et al.
patent: 6428189 (2002-08-01), Hochstein
patent: 6517218 (2003-02-01), Hochstein
patent: 6568833 (2003-05-01), Worgan et al.
patent: 6573536 (2003-06-01), Dry
patent: 6578986 (2003-06-01), Swaris et al.
patent: 6590773 (2003-07-01), Lin
patent: 6614103 (2003-09-01), Durocher et al.
patent: 6641284 (2003-11-01), Stopa et al.
patent: 6834977 (2004-12-01), Suchiro et al.
patent: 6846093 (2005-01-01), Swaris et al.
patent: 6874911 (2005-04-01), Yoneda
patent: 6963131 (2005-11-01), Frisch et al.
patent: 6999318 (2006-02-01), Newby
patent: 7165863 (2007-01-01), Thomas et al.
patent: 2002/0185726 (2002-12-01), North et al.
patent: 2003/0072153 (2003-04-01), Matsui et al.
patent: 2003/0142500 (2003-07-01), Bachl et al.
patent: 2004/0052077 (2004-03-01), Shih
patent: 2004/0120156 (2004-06-01), Ryan
patent: 2004/0184272 (2004-09-01), Wright et al.
patent: 2004/0264195 (2004-12-01), Chang et al.
patent: 2006/0145334 (2006-07-01), Tsukada et al.
patent: 2 342 140 (2001-09-01), None
Cariaso Alan
Dickinson Wright PLLC
Federal-Mogul World Wide Inc.
Lovell Leah S.
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